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Product
LSCF Series 3D Linear Spectral Confocal Sensor-LSCF500
This sensor is applied to dimension measurement of bonding adhesives on in-vehicle displays, including glue height and glue width, as well as defect inspection for excess glue, insufficient glue and glue overflow. It also supports wafer defect detection.
Product Description

Specifications

  • Line Length: 4 mm
  • Measurable Angle Range: ±16°
  • Z-axis Repeatability: ±0.05 μm
  • Depth of Field: 1.1 mm
  • Full Depth-of-Field Scanning Speed: 2400 lines per second

Product Advantages

It features high precision and outstanding layer discrimination capability, delivering excellent performance on transparent materials and adhesives. Ideal for bonding adhesive measurement, as well as dimensional inspection and defect detection of semiconductor chips.

Application Cases

Adhesive dispensing & bonding measurement for display manufacturers such as BOE and TCL; Micro LED chip inspection for Chenxian.
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