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X-Ray Industrial Non-Destructive Testing Product Series
Equipment Description:

Dual-column CT :
An advanced non-destructive testing technology that generates 3D voxel data and provides more comprehensive and accurate internal information of objects.


Circular CT :
Dual-angle image acquisition in as fast as 3 seconds;Real-time reconstruction & automatic detection ＜ 1.5s;
Maximum field of view > 70mm (under specific configurations);
150kV or 180kV integrated sealed tube available; 98μm CMOS flat panel or 100μm TFT flat panel available;
Free scanning mode with arbitrary angle and arbitrary speed; Maximum rotation speed: 30°/s;
Maximum rotation angle: 360°;
Maximum magnification: 10×;
Continuous forward and reverse rotation clockwise or counterclockwise.

Benchtop CT :

High Resolution : Maximum detail resolution ≤ 10 μm.
Low Cost : Adopts an integrated sealed tube X-ray source, maintenance-free.
High Performance : 130 kV high-energy X-ray source with high-precision CMOS flat panel detector.
Flexible Operating Environment : Benchtop design for flexible installation space.
Self-Shielding : Radiation protection level < 1 μSv/h, no additional radiation shielding required.

Flat-Panel CT :
This system is a high-throughput automated planar CT inspection platform designed for PCBs and electronic components.

It adopts precision in-plane 360° circular scanning technology and also features a fast linear scanning mode, achieving a technological breakthrough of "reconstruction while scanning". It enables high-precision inspection of multi-layer complex samples in the field of semiconductor advanced packaging


2D X-Ray:
Semi-automatic X-Ray inspection equipment is equipped with an integrated microfocus X-ray source and a high-resolution digital flat panel detector. It enables high-precision measurement and analysis of the internal structural features of objects without damaging them.
Typical applications include new energy batteries (cell OH, planar defects), semiconductors (PCB, chips), photovoltaics (junction boxes), etc. It can be used for small-batch inspection on production lines or process analysis in laboratories.



Equipment advantages
2D X-Ray

Equipped with a 6-axis electric system, motion programs and inspection parameters are flexibly adjustable;

Microfocus X-ray source with a minimum focal spot of 5 μm and up to 10× magnification, delivering high-definition images;

Built with basic image preprocessing and manual measurement tools;

Customizable automatic defect detection algorithms for new energy batteries are available as options;

Pre-set position programs enable multi-task semi-automatic inspection.

Flat-Panel CT

No slicing or grinding required; non-destructive to samples, enabling inspection of internal structural defects;

3D reconstruction function allows arbitrary selection of slice positions with clear visibility layer by layer;

Maximum X-ray cone angle of 118° for higher longitudinal image resolution;

Maximum system resolution of 8 μm, maximum pixel accuracy of 5 μm.


Dual-column CT
7-axis infinitely adjustable control with positioning accuracy up to micron level;High-power microfocus X-ray source equipped with ultra-high-speed and high-resolution detector to achieve optimal image quality;Ultra-large data capacity and higher computing efficiency also meet the semi-automatic inspection requirements of production lines;Post-processing supports fully automatic inspection solutions, enabling precise feature point recognition, automatic defect judgment, material porosity analysis, dimension measurement and other functions.
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